Capasiti bwrdd anhyblyg | |
Nifer o haenau: | 1-42 haen |
Deunydd: | FR4\uchel TG FR4\Deunydd di-blwm\CEM1\CEM3\Alwminiwm\Craidd metel\PTFE\Rogers |
Trwch Cu haen allan: | 1-6OZ |
Trwch Cu haen fewnol: | 1-4OZ |
Ardal brosesu uchaf: | 610*1100mm |
Trwch bwrdd lleiaf: | 2 haen 0.3mm (12mil) |
4 haen 0.4mm (16mil) | |
6 haen 0.8mm (32mil) | |
8 haen 1.0mm (40mil) | |
10 haen 1.1mm (44mil) | |
12 haen 1.3mm (52mil) | |
14 haen 1.5mm (59mil) | |
16 haen 1.6mm (63mil) | |
Lled Isafswm: | 0.076mm (3mil) |
Lleiafswm Lle: | 0.076mm (3mil) |
Maint twll lleiaf (twll olaf): | 0.2mm |
Cymhareb agwedd: | 10:01 |
Maint twll drilio: | 0.2-0.65mm |
Goddefgarwch drilio: | +\-0.05mm(2mil) |
Goddefgarwch PTH: | Φ0.2-1.6mm + \-0.075mm (3mil) |
Φ1.6-6.3mm+ \-0.1mm(4mil) | |
Goddefgarwch NPTH: | Φ0.2-1.6mm + \-0.05mm(2mil) |
Φ1.6-6.3mm+ \-0.05mm(2mil) | |
Goddefgarwch bwrdd gorffen: | Trwch <0.8mm, Goddefgarwch: +/- 0.08mm |
0.8mm≤Trwch≤6.5mm, Goddefgarwch +/- 10% | |
Isafswm pont mwgwd solder: | 0.076mm (3mil) |
Troelli a phlygu: | ≤0.75% Isafswm: 0.5% |
Raneg o TG: | 130-215 ℃ |
Goddefgarwch rhwystriant: | +/- 10%, Isafswm +/- 5% |
Triniaeth arwyneb: | HASL, LF HASL |
Aur Trochi, Aur Flash, Bys Aur | |
Arian Trochi, Tun Trochi, OSP | |
Platio Aur Dewisol, trwch Aur hyd at 3um(120u”) | |
Argraffu Carbon, S/M Peelable, ENEPIG | |
Capasiti bwrdd alwminiwm | |
Nifer o haenau: | Haen sengl, haenau dwbl |
Maint bwrdd uchaf: | 1500*600mm |
Trwch bwrdd: | 0.5-3.0mm |
Trwch copr: | 0.5-4 owns |
Maint twll lleiaf: | 0.8mm |
Lleiafswm lled: | 0.1mm |
Lleiafswm gofod: | 0.12mm |
Maint pad lleiaf: | 10 micron |
Gorffeniad wyneb: | HASL, OSP, ENIG |
Siapio: | CNC, Dyrnu, V-toriad |
Offer: | Profwr Cyffredinol |
Profwr Hedfan Agored/Byr | |
Microsgop pŵer uchel | |
Pecyn Profi Solderability | |
Profwr Cryfder Peel | |
Profwr Folt Uchel Agored a Byr | |
Pecyn Mowldio Trawstoriad Gyda Polisher | |
Gallu FPC | |
Haenau: | 1-8 haen |
Trwch bwrdd: | 0.05-0.5mm |
Trwch copr: | 0.5-3OZ |
Lled Isafswm: | 0.075mm |
Lleiafswm gofod: | 0.075mm |
Mewn trwy faint twll: | 0.2mm |
Maint twll laser lleiaf: | 0.075mm |
Maint twll dyrnu lleiaf: | 0.5mm |
Goddefgarwch mwgwd solder: | +\-0.5mm |
Goddefgarwch dimensiwn llwybro lleiaf: | +\-0.5mm |
Gorffeniad wyneb: | HASL, LF HASL, Arian Trochi, Aur Trochi, Aur Flash, OSP |
Siapio: | Dyrnu, Laser, Torri |
Offer: | Profwr Cyffredinol |
Profwr Hedfan Agored/Byr | |
Microsgop pŵer uchel | |
Pecyn Profi Solderability | |
Profwr Cryfder Peel | |
Profwr Folt Uchel Agored a Byr | |
Pecyn Mowldio Trawstoriad Gyda Polisher | |
Capasiti anhyblyg a hyblyg | |
Haenau: | 1-28 haen |
Math o ddeunydd: | FR-4(Tg Uchel, Heb Halogen, Amlder Uchel) |
PTFE, BT, Getek, sylfaen alwminiwm, sylfaen copr, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
Trwch bwrdd: | 6-240mil/0.15-6.0mm |
Trwch copr: | 210um (6 owns) ar gyfer haen fewnol 210um (6 owns) ar gyfer haen allanol |
Isafswm maint dril mecanyddol: | 0.2mm/0.08” |
Cymhareb agwedd: | 2:01 |
Maint mwyaf y panel: | Ochr sigl neu ochrau dwbl: 500mm * 1200mm |
Haenau aml-haen: 508mm X 610mm (20 ″ X 24 ″) | |
Lled/gofod llinell isaf: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
Trwy'r math o dwll: | Yn ddall / wedi'i gladdu / wedi'i blygio (VOP, VIP…) |
HDI / Microvia: | OES |
Gorffeniad wyneb: | HASL, LF HASL |
Aur Trochi, Aur Flash, Bys Aur | |
Arian Trochi, Tun Trochi, OSP | |
Platio Aur Dewisol, trwch Aur hyd at 3um(120u”) | |
Argraffu Carbon, S/M Peelable, ENEPIG | |
Siapio: | CNC, Dyrnu, V-toriad |
Offer: | Profwr Cyffredinol |
Profwr Hedfan Agored/Byr | |
Microsgop pŵer uchel | |
Pecyn Profi Solderability | |
Profwr Cryfder Peel | |
Profwr Folt Uchel Agored a Byr | |
Pecyn Mowldio Trawstoriad Gyda Polisher |
Amser postio: Medi-05-2022